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  • Winbond W25X40CL QSPI NOR parts catalog
    “G” in the 13th character of Winbond part number identifies parts manufactured using renewable energy (e g , W25H02JVTBIMG vs W25H02JVTBIM) All specifications and features are identical; only the manufacturing electricity source differs All Winbond Flash products are Halogen-Free and RoHS compliant packaging Refer to the datasheet for details and specifications "Y" in the "Carbon Data
  • QSPI NOR - 闪存 - 华邦电子 - Winbond
    低功耗 为了满足多样化的电源需求与先进的系统设计，QSPI NOR提供多样的电压选项，为不同应用的需求量身设计。除了标准的 3V 与 1 8V 之外，还提供以下选择： 单一1 2V产品：适合搭配采用先进制程的SoC，如提供高算力的AI加速芯片、高阶边缘运算芯片、先进高带宽网卡、具有AI功能的穿戴式设备
  • W25X40CL - QSPI NOR - Code Storage Flash - Winbond
    This part no is not available Please contact us for more information Contact us
  • QSPI NOR - Code Storage Flash - Winbond
    High-Performance and Low-Power Serial Memory Solutions The W25Q and W25H QSPI NOR offer robust non-volatile memory solutions designed to meet the rigorous demands of modern embedded systems Supporting Single, Dual, and Quad I O modes , the architecture delivers high bandwidth performance in small form factors This combination of efficiency and compact design makes the family ideal for code
  • ドキュメント - ウィンボンド
    検索結果“ W25X40CL ” 1 項目が該当しました
  • 技術文件 - 華邦電子 - Winbond
    搜尋結果 13219 項符合 文件名稱
  • 技术文档 - 华邦电子 - Winbond
    产品线 产品家族 類別 搜尋結果 13221 項符合 文件名稱 類別 更新日期 文件格式 文件名稱 128M*8 DDR2 WBGA60 IBIS Model 類別 IBIS Model 更新日期 2012-07-18 文件格式 zip 文件名稱 256K x 8 ELECTRICALLY ERASABLE EPROM DATA SHEET 類別 Datasheet 更新日期 2007-01-26 文件格式 pdf 文件名稱 AN0000001 Winbond Flash Device ID 類別 应用须知
  • Overview - Winbond
    Winbond has committed to providing green products and green manufacture on our product design, R D, and processes, leveraging advancements in decarbonization technologies without compromising the quality and durability of our products
  • ONFI NAND - Code Storage Flash - Winbond
    ONFI 1 0 Compliant W29N ONFI NAND for High Density Applications The W29N ONFI NAND Flash is designed to serve as a high-density code storage solution, with densities ranging from 1Gb to 8Gb It is fully compliant with the ONFI 1 0 standard, ensuring it meets established industry specifications This adherence enables it to offer a compatible and direct drop-in replacement for products from
  • Locations - Headquarters - Taiwan - Winbond
    No 35, Luke 5th Rd , Kaohsiung Science Park, Luzhu Dist , Kaohsiung City 821011, Taiwan





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